Products
Contact Us
- Contact Person : Ms. Wang Sarah
- Company Name : Shenzhen Western Hemisphere Technology Co., Ltd.
- Tel : 86-755-61514569
- Fax : 86-755-61514586
- Address : Guangdong,Shenzhen,Building B, Licheng Technology Industrial Park, Shajing Gonghe,Bao'an District
- Country/Region : China
- Zip : 518104
Other Electronic Components
UV dicing type
1.Application:Wafer Protection
2.Type: Insulation Tape
3.Tensile Strength :30 N/10MM
4.Adhesion(Before UV) :3.00 N/10mm
Detailed Product Description- Dicing, protecting wafers - UV curing type - Improved back side chipping, contamination by water Feature:*Wafer dicing,...
UV dicing type
1.Application:Wafer Protection
2.Type: Insulation Tape
3.Tensile Strength :30 N/10MM
4.Adhesion(Before UV) :3.00 N/10mm
Description:1.Application:Wafer Protection 2.Type: Insulation Tape 3.Tensile Strength :30 N/10MM 4.Adhesion(Before UV) :3.00...
wafer tape
1.Application:Wafer Protection
2.Type: Insulation Tape
3.Tensile Strength :30 N/10MM
4.Adhesion(Before UV) :3.00 N/10mm
Description:- Dicing, protecting wafers - UV curing type - Improved back side chipping, contamination by water Feature:*Wafer dicing, Wafer...
Best Elep holder back grinding type
1.Type: Dicng Tape for BGA Board
2.Material: Polyolefin(PO)
3.Adhesion(Before UV) 9.00 N/20mm
4.Adhesion(After UV) 0.20
Detailed Product Description- Applicable to thick blade(under 200um) - Expandable type(PO film) - Srong holding and easy peel(UV Curable) ...
UV dicing type
1.Application:Wafer Protection
2.Type: Insulation Tape
3.Tensile Strength :30 N/10MM
4.Adhesion(Before UV) :3.00 N/10mm
Product Description:- Dicing, protecting wafers - UV curing type - Improved back side chipping, contamination by water Feature:*Wafer dicing,...
UV dicing type
1.Application:Wafer Protection
2.Type: Insulation Tape
3.Tensile Strength :30 N/10MM
4.Adhesion(Before UV) :3.00 N/10mm
Detailed Product Description- Dicing, protecting wafers - UV curing type - Improved back side chipping, contamination by water Feature:*Wafer dicing,...
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