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- Contact Person : Ms. Wang Sarah
- Company Name : Shenzhen Western Hemisphere Technology Co., Ltd.
- Tel : 86-755-61514569
- Fax : 86-755-61514586
- Address : Guangdong,Shenzhen,Building B, Licheng Technology Industrial Park, Shajing Gonghe,Bao'an District
- Country/Region : China
- Zip : 518104
Best Elep holder back grinding type
Product Detailed
Related Categories:Other Electronic Components
Related Product Searches:Best Elep holder back grinding type,High Quality,Dicing tape for BGA board, UV Curable,WH170
1.Type: Dicng Tape for BGA Board
2.Material: Polyolefin(PO)
3.Adhesion(Before UV) 9.00 N/20mm
4.Adhesion(After UV) 0.20
Detailed Product DescriptionRelated Product Searches:Best Elep holder back grinding type,High Quality,Dicing tape for BGA board, UV Curable,WH170
- Applicable to thick blade(under 200um) - Expandable type(PO film) - Srong holding and easy peel(UV Curable)
Best Elep holder back grinding type
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