Products
Contact Us
- Contact Person : Ms. Wang Sarah
- Company Name : Shenzhen Western Hemisphere Technology Co., Ltd.
- Tel : 86-755-61514569
- Fax : 86-755-61514586
- Address : Guangdong,Shenzhen,Building B, Licheng Technology Industrial Park, Shajing Gonghe,Bao'an District
- Country/Region : China
- Zip : 518104
Insulation Materials & Elements
PTFE Tape
Widely used in the close painting of thermally conductive roll mandrel which is high temperature resisting, acid resisting.
Carrier: PTFE, Color: Black/Grey;Carrier Thickness: 0.05mm; Total Thickness: 0.08mmCarrier Thickness: 0.08mm; Total Thickness: 0.13mmCarrier Thickness:...
PTFE Tape
Widely used in the close painting of thermally conductive roll mandrel which is high temperature resisting, acid resisting.
Carrier: PTFE, Color: Black/Grey;Carrier Thickness: 0.05mm; Total Thickness: 0.08mmCarrier Thickness: 0.08mm; Total Thickness: 0.13mmCarrier Thickness:...
Thermally Conductive Adhesive Tape
1.Application:LED lights
2.Material: Silicone
3.Certificates: UL, RoHS, REACH
4.Temp: -30~+265
5.Thickness:0.05-1.0mm
Product Description: XBQ-BP series provides a better way for applications requiring good adhesion strength and superior thermal...
ELEP HOLDER BACK GRINDING TAPE
- Applicable to thick blade(under 200um)
- Expandable type(PO film)
- Srong holding and easy peel(UV Curable)
ELEP HOLDER BACK GRINDING TAPE
...
Thermally Conductive Tape
Provide efficient thermal transfer for a wide range of applications including bonding heat sinks, heat spreaders, ICpackages,etc
Carrier: Silicon , Color: White; Total Thickness: 0.125mm;Long Term Temperature Resistance: 120°CShort Term Temperature Resistance:...
UV DICING TAPE
- Dicing, protecting wafers
- UV curing type
- Improved back side chipping, contamination by water
Feature:*Wafer dicing, Wafer protection*UV curing type*Expandable type*Precented dicing wafer from penetrating into interface*Improved back side chipping*Improved back side...
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